Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module

Author

Hyun Suk Lee, Giseok Yun, Ju-Hwan Song, and Do-Nyun Kim 

Journal

Microelectronics Reliability

Volume

160

Page

115469

Year

2024

Date

2024-09-01

Link

https://www.sciencedirect.com/science/article/pii/S0026271424001495 100회 연결