Abstract

Detecting defects in the inspection stage of semiconductor manufacturing process is a crucial task to improve yield and productivity as well as wafer quality. Recent Advances in semiconductor process technology have greatly increased the transistor density. As a result, an increasingly high number of defects inevitably emerge and we need a more accurate and efficient detection method to manage them. In this paper, we propose a deep-learning-based defect detection model to expedite the process. It adopts an adversarial network architecture of conditional GAN. The discriminator of an adversarial network architecture helps the detection model learn to detect and classify defects accurately. The high performance is achieved by using Focal Loss, PixelGAN and multi-scale level features, which is shown to be better than the baseline model, CenterNet, when tested for a real industrial dataset.